|
Xbox360 Red Ring Of Death & E74 Issues:
Since the product's introduction in November, 2005, a significant quantity of Microsoft's Xbox 360game consoles have experienced a field malfunction that is indicated by three flashing red LEDs on the front of the console. This error function, which designates a critical hardware failure and renders the unit inoperable, is known among gamers as the "Red Ring of Death" and has spawned numerous user forums and web postings that claim to offer easy "fixes" for out-of-warranty units or for users who lack the patience to return their systems to an authorized repair center. Obviously, if there were
an easy fix, Microsoft probably wouldn't have announced their intention to
spend more than $1 billion to
extend warranties to three years for the
millions of
game consoles it
has sold worldwide. The problem was lately discovered being the cracked solder joints under the Graphic Process Unit (GPU) . As the GPU is a BGA (
Ball Grid Array) surfice mount device, therefore reapair process is complicated and costly.
PS3 "Yellow LED of Death" YLOD issue
Very similar to Xbox360, the PS3 also suffered from Graphic Processor Unit problem. The sympton is: when the PS3 is turned on, the indication LED goes green for 1 second then turns to yellow for 1 second. The PS3 then shuts itself down and LED stays in red and blinking. There is no sound or vidoe on sceen.
Solutions
To fix the problem , the said GPU chip must be properly reflowed or even removed and reballed then soldered back to the motherboard. Consoletronics has acquired a BGA re-work station and also developed temperature profiles that can successfully do the job for
PS3 and Xbox360 motherboards. We have learned that most of the GPU related problem console can be fixed by a successful reflow. Only few of the nasty ones will need the GPU completely removed and reballed. With the
BGA re-work station programmed with correct temperature and timing profiles, the result of a successful reflow is the same as reball.
Unlike heat guns, the BGA re-work staition can precisely heat up the GPU to the point that hundreds of solder balls under the GPU are just evenly liquefying without damaging the GPU and motherboard. With every single solder balls liquefying and the help of BGA solder paste, cracked solder balls will be automatically soldered to the solder pads right below. This is achieved by the BGA re-work station programmed with specially designed temperature and timing profiles, driving two hot air nozzles and one infread pre-heater that the BGA re-work station is equipped. The infread pre-heater ensures no warp of the motherboard during the heat-up process.
Without the correct temperature and timing profiles, BGA re-work station is no more than a heat gun.
BGA re-work station
PS3 Graphic Process Unit
Xbox360 motherboard with the GPU removed
The re-balled Xbox360 GPU
PS3 motherboard with the GPU removed
Re-balled PS3 GPU
 |
